Nexperia has announced the release of 14 rectifiers for power applications in its new CFP2-HP (Clip-Bonded FlatPower) packaging. Available in standard and AEC-Q101 versions, these include 45 V, 60 V and 100 V Trench Schottky rectifiers (with 1 and 2 A options) including the PMEG100T20ELXD-Q, a 100 V, 2 A Trench Schottky barrier rectifier. For applications requiring hyperfast recovery Nexperia has also added the 200 V, 1 A PNE20010EXD-Q rectifier to the portfolio.
In modern car architectures the number of electronic control units (ECU) is gradually being reduced in favor of fewer high performing, feature-rich ECUs responsible for front axle, rear axle and body control. As a result, the component density of these units is dramatically increasing and in order to realize these higher density designs, manufacturers increasingly rely on modern multilayer PCBs. The vertical thermal design on these multilayer PCBs enables designers to save up to 75% of board space with CFP2-HP compared to using a device in a SMA package, while still maintaining the same level of electrical performance. This rugged package design enables longer operating times and better board level reliability, while the new lead shape improves automatic optical inspection (AOI).
Today, CFP packaging is used by different power diode technologies such as Nexperia’s Schottky, silicon germanium and recovery rectifiers but can also be extended to bipolar transistors. It offers significant product diversity, covering single/dual configuration and currents between 1-20 A, simplifying board design.
