STMicroelectronics and eYs3D Microelectronics will reveal the results of their collaboration on high-quality machine vision at CES 2023 in Las Vegas on January 5-8. Using live demonstrations, the companies will show how stereo video and depth camera made from advanced active-coded infrared technology can enhance capabilities like feature recognition and autonomous guidance at mid-to-long working range.
The CES demonstrations highlight two jointly developed reference designs, the Ref-B6 and Ref-B3 ASV (Active Stereo Vision) video and depth cameras. Both combine the eYs3D CV processor and eSP876 stereo 3D Depth-Map chipset with ST’s global shutter image sensors that provide enhanced near-infrared (NIR) sensitivity. The embedded eYs3D chipset enhances object edge detection, optimizes depth de-noising, and outputs HD-quality 3D depth data up to 60 fps frame rate. ST’s image sensors enable the cameras to output data streams in various combinations of video/depth resolution and frame rate for the best quality depth sensing and point-cloud creation.
In addition, optimized lenses, filters and a VCSEL active-IR projector source optimize the infrared optical path and maximize immunity to ambient light noise. A specially developed control algorithm turns the IR projector on and off alternately to permit capturing artifact-free gray scale images. Leveraging this advanced hardware design, the Ref-B6 stereo-video camera achieves a 6-centimeter baseline and 85deg(H) x 70deg(V) depth field of view.
Both eYs3D reference designs include the SDK (Software Development Kit) supporting Windows®, Linux and Android OS environments with multiple different programming languages and wrapper APIs.
