The TDM2254xD series products blend innovation in robust OptiMOS TM MOSFET technology with novel packaging and proprietary magnetic structure to deliver industry-leading electrical and thermal performance with robust mechanical design. This lets data centers operate at higher efficiency to meet the high power demands of AI GPU (Graphic Processor Unit) platforms while also significantly reducing total cost of ownership (TCO).
Given that AI servers require 3 times more energy than traditional servers, and data centers already consume more than 2 percent of the global energy supply, it is essential to find innovative power solutions and architecture designs that further drive decarbonization. Paving the way for the green AI factory, Infineon’s TDM2254xD dual-phase power modules combine with XDP TM Controller technology to enable efficient voltage regulation for high-performance computing platforms with superior electrical, thermal and mechanical operation.
Infineon introduced the TDM2254xD series at the Applied Power Electronics Conference (APEC). The modules’ unique design allows for efficient heat transfer from the power stage on to the heat sink through novel inductor design that is optimized to transfer current and heat, thereby allowing for a 2 percent higher efficiency than industry average modules at full load. Improving power efficiency at the core of a GPU yields significant energy savings at scale. This translates into megawatts saved for data centers computing generative AI and in turn leads to reduced CO2 emissions and millions of dollars in operating cost savings over the system’s lifetime.
