Share platform design in 800 V application
Module interface can be easily integrated at customer application
Modular design can save the development cost and assembling cost
Lower tray inductance and higher power density
HV inverter brick – Embedded Power Module, cooler, DC link, hall sensor, and GDB
800 V SiC module: Ipeak = 650 Arms @930 V, 10 s, 10 L/min, 65 °C
Stray inductance ≤3 nH (including busbar)
DC Link capacitor: scalability based on the customer application
Connection between PWM and DC&AC Busbar: laser welding
Connection between PWM and PCB: floating connector
